The aixDBLI is a highly accurate laser interferometry system designed to measure ultra-small thickness changes in piezoelectric thin films under electrical excitation. Using a proven double beam technique, it eliminates bending artifacts and achieves resolutions as fine as 0.2 pm/V. Ideal for both R&D and mass production, it offers fast measurement, wafer mapping, and high repeatability for process control and optimization.

The Piezoelectric Evaluation System (aixPES) is a multifunctional test platform designed for comprehensive electrical and electromechanical characterization of piezoelectric materials and devices. First introduced in 2002, it has become an industry standard for piezoelectric testing, offering high accuracy, repeatability, and flexibility.

With modular sample holders and extensions, aixPES supports bulk ceramics, thin films, polymers, and MEMS structures across wide temperature ranges (–100 °C to 600 °C). Its features include automated measurements, multiple-sample testing, and advanced scanning capabilities, making it ideal for both research and product development.

The system ensures reliable, user-independent measurements of piezoelectric properties, from prototyping to quality control, while accommodating future upgrades to meet evolving testing needs.