The AWgage‑150 is a non-contact sheet resistance and thin‑film thickness measurement tool, designed for wafers from 2″ to 6″. It accurately measures sheet resistance from 1 mΩ/□ up to 19,990 Ω/□ and deduces film thickness from known resistivity values. Featuring a touchscreen interface, automated wafer handling, high repeatability, and a compact, energy-efficient design, it’s ideal for semiconductor metrology applications.

Allwin21 Corp. has been focusing on providing solutions and enhancements to plasma Etch RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge.

Allwin21 Corp. has been focusing on providing solutions and enhancements to  plasma asher descum semiconductor process. These OEM asher descum semiconductor equipment have been used in production and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge.

Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment.  Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors  and Vacuum Rapid Thermal Processors.  Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.